Log in
Enquire now
‌

US Patent 11534828 Assembling structures comprising 3D printed components and standardized components utilizing adhesive circuits

OverviewStructured DataIssuesContributorsActivity

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
115348280
Patent Inventor Names
Antonio Bernerd Martinez0
Broc William TenHouten0
Chukwubuikem Marcel Okoli0
Eli Rogers0
Kevin Robert Czinger0
Date of Patent
December 27, 2022
0
Patent Application Number
158558000
Date Filed
December 27, 2017
0
Patent Citations
‌
US Patent 10357829 Three-dimensional printing of three-dimensional objects
‌
US Patent 10429006 Cellular structures with twelve-cornered cells
0
‌
US Patent 10434573 Accurate three-dimensional printing
‌
US Patent 10435185 3-D printed packaging
0
‌
US Patent 10435773 Rapidly solidified high-temperature aluminum iron silicon alloys
‌
US Patent 10436038 Turbine engine with an airfoil having a tip shelf outlet
‌
US Patent 10438407 Solid modeler that provides spatial gradients of 3D CAD models of solid objects
‌
US Patent 10440351 Tilts as a measure of user engagement for multiview interactive digital media representations
...
Patent Primary Examiner
‌
Joanna Pleszczynska
0
CPC Code
‌
B62D 27/023
0
‌
B62D 27/026
0
‌
B62D 65/02
0
‌
B33Y 80/00
0

One aspect is an apparatus including a plurality of additively manufactured components each having an adhesive injection channel. The components are connected together such that adhesive injection channels are aligned to form an adhesive path that allows adhesive flow between the components. Another aspect is an apparatus, including an additively manufactured component having an adhesive injection channel and an adhesive flow mechanism comprising at least one of an adhesive side end effector or a vacuum side end effector, the adhesive flow mechanism configured to provide adhesive to the adhesive injection channels.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 11534828 Assembling structures comprising 3D printed components and standardized components utilizing adhesive circuits

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.