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US Patent 10421863 Composite reinforcing material and molding material

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
November 27, 2017
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Date of Patent
September 24, 2019
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Patent Application Number
15823126
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Patent Citations Received
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US Patent 12115583 Systems and methods for adhesive-based part retention features in additively manufactured structures
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US Patent 11504912 Selective end effector modular attachment device
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US Patent 11885000 In situ thermal treatment for PBF systems
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US Patent 11884025 Three-dimensional printer and methods for assembling parts via integration of additive and conventional manufacturing operations
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US Patent 12083596 Thermal elements for disassembly of node-based adhesively bonded structures
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US Patent 12090551 Removal of supports, and other materials from surface, and within hollow 3D printed parts
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US Patent 11479015 Custom formed panels for transport structures and methods for assembling same
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US Patent 11529741 System and method for positioning one or more robotic apparatuses
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US Patent 10605285 Systems and methods for joining node and tube structures
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US Patent 11534828 Assembling structures comprising 3D printed components and standardized components utilizing adhesive circuits
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•••
Patent Inventor Names
Nagisa Kamiya
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Shoji Hasegawa
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10421863
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Patent Primary Examiner
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Peter D. Mulcahy
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