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US Patent 10416095 Material detection and analysis using a dielectric waveguide

Patent 10416095 was granted and assigned to Texas Instruments on September, 2019 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Texas Instruments
Texas Instruments
Date Filed
June 29, 2018
Date of Patent
September 17, 2019
Patent Applicant
Texas Instruments
Texas Instruments
Patent Application Number
16024028
Patent Citations Received
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US Patent 12115583 Systems and methods for adhesive-based part retention features in additively manufactured structures
0
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US Patent 11504912 Selective end effector modular attachment device
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US Patent 12083596 Thermal elements for disassembly of node-based adhesively bonded structures
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US Patent 12090551 Removal of supports, and other materials from surface, and within hollow 3D printed parts
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US Patent 11479015 Custom formed panels for transport structures and methods for assembling same
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US Patent 11529741 System and method for positioning one or more robotic apparatuses
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US Patent 10605285 Systems and methods for joining node and tube structures
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US Patent 11534828 Assembling structures comprising 3D printed components and standardized components utilizing adhesive circuits
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US Patent 11535322 Omni-positional adhesion device
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US Patent 10663110 Metrology apparatus to facilitate capture of metrology data
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10416095
Patent Primary Examiner
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Jermele M Hollington

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