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US Patent 10297578 Memory device

Patent 10297578 was granted and assigned to Toshiba Memory Corporation on May, 2019 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
Toshiba Memory Corporation
Toshiba Memory Corporation
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Date Filed
September 15, 2017
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Date of Patent
May 21, 2019
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Patent Applicant
Toshiba Memory Corporation
Toshiba Memory Corporation
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Patent Application Number
15706017
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Patent Citations Received
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US Patent 12068286 Device with embedded high-bandwidth, high-capacity memory using wafer bonding
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US Patent 11756946 Semiconductor storage device
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US Patent 11764200 High density architecture design for 3D logic and 3D memory circuits
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US Patent 11349073 Semiconductor memory device
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US Patent 11387216 Semiconductor memory device
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US Patent 11417642 Semiconductor storage device
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US Patent 11430756 Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
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US Patent 11889777 Semiconductor memory device
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US Patent 11923341 Memory device including modular memory units and modular circuit units for concurrent memory operations
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US Patent 11462503 Hybrid bonding using dummy bonding contacts
•••
Patent Inventor Names
Ryota Katsumata
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Genki Fujita
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Jun Iijima
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Masayoshi Tagami
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Takamasa Usui
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Tetsuya Shimizu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10297578
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Patent Primary Examiner
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Theresa T Doan
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