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US Patent 10297578 Memory device

Patent 10297578 was granted and assigned to Toshiba Memory Corporation on May, 2019 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Toshiba Memory Corporation
Toshiba Memory Corporation
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Current Assignee
Toshiba Memory Corporation
Toshiba Memory Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
102975780
Patent Inventor Names
Ryota Katsumata0
Genki Fujita0
Jun Iijima0
Masayoshi Tagami0
Takamasa Usui0
Tetsuya Shimizu0
Date of Patent
May 21, 2019
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Patent Application Number
157060170
Date Filed
September 15, 2017
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Patent Citations Received
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US Patent 12068286 Device with embedded high-bandwidth, high-capacity memory using wafer bonding
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US Patent 11756946 Semiconductor storage device
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US Patent 11764200 High density architecture design for 3D logic and 3D memory circuits
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US Patent 11349073 Semiconductor memory device
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US Patent 11387216 Semiconductor memory device
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US Patent 11417642 Semiconductor storage device
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US Patent 11430756 Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
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US Patent 11889777 Semiconductor memory device
0
...
Patent Primary Examiner
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Theresa T Doan
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Patent abstract

A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.

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