List of Unimicron Technology patents

Patents where

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Unimicron Technology

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 8181342 Method for manufacturing a coreless packaging substrate	Patent 8181342 was granted and assigned to Unimicron Technology on May, 2012 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8181342	May 22, 2012
‌ US Patent 8033014 Method of making a molded interconnect device	Patent 8033014 was granted and assigned to Unimicron Technology on October, 2011 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8033014	October 11, 2011
‌ US Patent 9253898 Rigid flex board module and the manufacturing method thereof	Patent 9253898 was granted and assigned to Unimicron Technology on February, 2016 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	9253898	February 2, 2016
‌ US Patent 9370099 Manufacturing method of connector	Patent 9370099 was granted and assigned to Unimicron Technology on June, 2016 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	9370099	June 14, 2016
‌ US Patent 8729397 Embedded structure	Patent 8729397 was granted and assigned to Unimicron Technology on May, 2014 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8729397	May 20, 2014
‌ US Patent 9320143 Touch member and method of manufacturing the same	Patent 9320143 was granted and assigned to Unimicron Technology on April, 2016 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	9320143	April 19, 2016
‌ US Patent 7820233 Method for fabricating a flip chip substrate structure	Patent 7820233 was granted and assigned to Unimicron Technology on October, 2010 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	7820233	October 26, 2010
‌ US Patent 11127664 Circuit board and manufacturing method thereof	Patent 11127664 was granted and assigned to Unimicron Technology on September, 2021 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	11127664	September 21, 2021
‌ US Patent 8132321 Method for making embedded circuit structure	Patent 8132321 was granted and assigned to Unimicron Technology on March, 2012 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8132321	March 13, 2012
‌ US Patent 8191248 Method for making an embedded structure	Patent 8191248 was granted and assigned to Unimicron Technology on June, 2012 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8191248	June 5, 2012
‌ US Patent 11134567 Embedded component structure and manufacturing method thereof	Patent 11134567 was granted and assigned to Unimicron Technology on September, 2021 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	11134567	September 28, 2021
‌ US Patent 9045597 Polyimide compound having side chain and manufacturing method thereof	Patent 9045597 was granted and assigned to Unimicron Technology on June, 2015 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	9045597	June 2, 2015
‌ US Patent 7968991 Stacked package module and board having exposed ends	Patent 7968991 was granted and assigned to Unimicron Technology on June, 2011 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	7968991	June 28, 2011
‌ US Patent 8256106 Method for fabricating circuit board structure with capacitors embedded therein	Patent 8256106 was granted and assigned to Unimicron Technology on September, 2012 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8256106	September 4, 2012
‌ US Patent 9074051 Dianhydride monomer having side chain, polyimide compound having side chain and manufacturing method thereof	Patent 9074051 was granted and assigned to Unimicron Technology on July, 2015 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	9074051	July 7, 2015
‌ US Patent 8051560 Method of fabricating a solder pad structure	Patent 8051560 was granted and assigned to Unimicron Technology on November, 2011 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8051560	November 8, 2011
‌ US Patent 11114782 Method of manufacturing circuit board structure	Patent 11114782 was granted and assigned to Unimicron Technology on September, 2021 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	11114782	September 7, 2021
‌ US Patent 11166387 Wiring board and manufacturing method thereof	Patent 11166387 was granted and assigned to Unimicron Technology on November, 2021 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	11166387	November 2, 2021
‌ US Patent 8436254 Method of fabricating circuit board structure	Patent 8436254 was granted and assigned to Unimicron Technology on May, 2013 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8436254	May 7, 2013
‌ US Patent 8604359 Package substrate and fabrication method thereof	Patent 8604359 was granted and assigned to Unimicron Technology on December, 2013 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8604359	December 10, 2013
‌ US Patent 8274798 Carrier substrate and method for making the same	Patent 8274798 was granted and assigned to Unimicron Technology on September, 2012 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8274798	September 25, 2012
‌ US Patent 8049114 Package substrate with a cavity, semiconductor package and fabrication method thereof	Patent 8049114 was granted and assigned to Unimicron Technology on November, 2011 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8049114	November 1, 2011
‌ US Patent 8318411 Method for fabricating an interposer	Patent 8318411 was granted and assigned to Unimicron Technology on November, 2012 by the United States Patent and Trademark Office.		‌ Unimicron Technology	United States Patent and Trademark Office	8318411	November 27, 2012
‌ US Patent 11895773 Circuit board structure	Patent 11895773 was granted and assigned to Unimicron Technology on February, 2024 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	11895773	February 6, 2024
‌ US Patent 12016133 Circuit board with a conductive bump mounted on an adhesive layer	Patent 12016133 was granted and assigned to Unimicron Technology on June, 2024 by the United States Patent and Trademark Office.	‌ Unimicron Technology	‌ Unimicron Technology	United States Patent and Trademark Office	12016133	June 18, 2024

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