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US Patent 8191248 Method for making an embedded structure

Patent 8191248 was granted and assigned to Unimicron Technology on June, 2012 by the United States Patent and Trademark Office.

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Patent
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Patent attributes

Current Assignee
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Unimicron Technology
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
81912480
Patent Inventor Names
Shu-Sheng Chiang0
Yi-Chun Liu0
Wei-Ming Cheng0
Tsung-Yuan Chen0
Date of Patent
June 5, 2012
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Patent Application Number
122118160
Date Filed
September 17, 2008
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Patent Primary Examiner
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Carl Arbes
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Patent abstract

An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.

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