Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yi-Chun Liu0
Shu-Sheng Chiang0
Tsung-Yuan Chen0
Wei-Ming Cheng0
Date of Patent
May 20, 2014
0Patent Application Number
133238310
Date Filed
December 13, 2011
0Patent Primary Examiner
Patent abstract
An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.
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