US Patent 9590130 Thin film solder bond
Patent 9590130 was granted and assigned to AmberWave on March, 2017 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 30, 2012
0
Date of Patent
March 7, 2017
0
Patent Application Number
13460786
0
Patent Inventor Names
Mark Carroll
0
Anthony Lochtefeld
0
Chris Leitz
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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