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US Patent 9590130 Thin film solder bond

Patent 9590130 was granted and assigned to AmberWave on March, 2017 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
AmberWave
AmberWave
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
95901300
Patent Inventor Names
Mark Carroll0
Anthony Lochtefeld0
Chris Leitz0
Date of Patent
March 7, 2017
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Patent Application Number
134607860
Date Filed
April 30, 2012
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Patent Primary Examiner
‌
Bach Dinh
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Patent abstract

A device, system, and method for solar cell construction and bonding/layer transfer are disclosed herein. An exemplary structure of solar cell construction involves providing a monocrystalline donor layer. A solder bonding layer bonds the donor layer to a carrier substrate. A porous layer may be used to separate the donor layer.

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