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US Patent 9570351 Reusable semiconductor substrates

Patent 9570351 was granted and assigned to Hewlett Packard Enterprise on February, 2017 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
Hewlett Packard Enterprise
Hewlett Packard Enterprise
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Date Filed
July 9, 2015
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Date of Patent
February 14, 2017
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Patent Application Number
14795684
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Patent Citations Received
‌
US Patent 11930648 3D memory devices and structures with metal layers
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‌
US Patent 11711928 3D memory devices and structures with control circuits
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Patent Inventor Names
Di Liang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9570351
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Patent Primary Examiner
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Matthew Landau
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