US Patent 9564417 Multi-stacked structures of semiconductor packages
Patent 9564417 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on February, 2017 by the United States Patent and Trademark Office.
Is a
Date Filed
September 9, 2015
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Date of Patent
February 7, 2017
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Patent Application Number
14848415
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Patent Citations Received
Patent Inventor Names
Do-Il Kong
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Sung-Chul Hur
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Jong-Yun Yun
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Cheol Kwon
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Jae-Bum Byun
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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