Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Do-Il Kong0
Sung-Chul Hur0
Jong-Yun Yun0
Cheol Kwon0
Jae-Bum Byun0
Date of Patent
February 7, 2017
0Patent Application Number
148484150
Date Filed
September 9, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.
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