Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Lin Fu0
Wei Weng0
Alexei Leonov0
Jeffrey Dysard0
Lei Liu0
Steven Grumbine0
Date of Patent
January 31, 2017
0Patent Application Number
147502710
Date Filed
June 25, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of at least one of a copper, a copper barrier, and a dielectric layer.
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