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US Patent 9543242 Semiconductor package and fabricating method thereof

Patent 9543242 was granted and assigned to Amkor Technology on January, 2017 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12080563 Semiconductor devices and methods of manufacturing
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
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US Patent 11923331 Die attached leveling control by metal stopper bumps
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US Patent 11894317 Package structure and method for manufacturing the same
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US Patent 11881471 Semiconductor device and manufacturing method thereof
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US Patent 11862604 Systems and methods for releveled bump planes for chiplets
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Patent abstract

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

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Patent Inventor Names
David Hiner0
Michael Kelly0
Roger St. Amand0
Ronald Huemoeller0
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=095432420
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US Patent 11694906 Semiconductor devices and methods of manufacturing semiconductor devices
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US Patent 09543242 Semiconductor package and fabricating method thereof US Patent 9543242 Semiconductor package and fabricating method thereof

Infobox
Patent Number
095432420
Patent Number
95432420
Edits on 27 Sep, 2022
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Infobox
Is a
Patent
Patent
0
Patent Applicant
Amkor Technology
Amkor Technology
0
Current Assignee
Amkor Technology
Amkor Technology
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
095432420
Date of Patent
January 10, 2017
0
Patent Application Number
148236890
Date Filed
August 11, 2015
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=095432420
Patent Primary Examiner
‌
Quoc Hoang
0
Edits on 15 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=09543242
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created this topic on 10 Jan, 2022
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 US Patent 09543242 Semiconductor package and fabricating method thereof

Infobox
Is a
Patent
Patent
Patent applicant
Amkor Technology
Amkor Technology
Current assignee
Amkor Technology
Amkor Technology
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
09543242
Date of patent
January 10, 2017
Patent application number
14823689
Date Filed
August 11, 2015
Patent primary examiner
‌
Quoc Hoang

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