Patent attributes
Modular cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes an inlet manifold, a jet plate manifold, a plurality of jet plates, a vapor manifold, and a target layer. The inlet manifold includes a fluid distribution chamber, and a plurality of fluid distribution channels symmetrically located within the fluid distribution chamber. The jet plate manifold is coupled to the inlet manifold such that the plurality of jet plate openings is vertically aligned with respect to the plurality of fluid distribution channels. The plurality of jet plates is removably disposed in the jet plate manifold. The vapor manifold has a plurality of walls that define a vapor manifold opening and at least one outlet channel through at least one of the walls. The target layer is coupled to the vapor manifold such that the jet orifice surface of each jet plate is positioned above the target layer.
