Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Adam Gallegos0
Walter J. Dauksher0
Date of Patent
May 31, 2016
0Patent Application Number
139370400
Date Filed
July 8, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A chip package and methods of manufacturing the same are disclosed. In particular, a chip package comprising a ball grid array is disclosed in which the chip package includes a package substrate supporting the ball grid array and in which the chip package further includes a warpage control frame that helps to minimize or mitigate warpage of the chip package.
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