Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chwen-Ming Liu0
Victor Chiang Liang0
Yang-Che Chen0
Chen-Hua Lin0
Huang-Wen Tseng0
Date of Patent
July 2, 2024
0Patent Application Number
178854010
Date Filed
August 10, 2022
0Patent Citations
...
Patent Primary Examiner
CPC Code
Patent abstract
A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.
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