US Patent 9190321 Self-forming embedded diffusion barriers

Interconnect structures containing metal oxide embedded diffusion barriers and methods of forming the same. Interconnect structures may include an Mx level including an Mx metal in an Mx dielectric, an Mx+1 level above the Mx level including an Mx+1 metal in an Mx+1 dielectric, an embedded diffusion barrier adjacent to the Mx+1 dielectric; and a seed alloy region adjacent to the Mx+1 metal separating the Mx metal from the Mx+1 metal. The embedded diffusion barrier may include a barrier-forming material such as manganese, aluminum, titanium, or some combination thereof. The seed alloy region may include a seed material such as cobalt, ruthenium, or some combination thereof.