US Patent 8941233 Integrated circuit package with inter-die thermal spreader layers
Patent 8941233 was granted and assigned to Altera on January, 2015 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 22, 2012
Date of Patent
January 27, 2015
Patent Application Number
13402632
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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