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US Patent 8889485 Methods for surface attachment of flipped active componenets

Patent 8889485 was granted and assigned to Semprius on November, 2014 by the United States Patent and Trademark Office.

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US Patent 12112678 Hybrid pulse-width-modulation pixels
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US Patent 12094851 Particle capture using transfer stamp
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US Patent 12078689 Stray field rejection in magnetic sensors
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US Patent 12080690 Micro assembled LED displays and lighting elements
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US Patent 12074583 Printing components to adhesive substrate posts
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US Patent 12068739 Micro-transfer-printed acoustic wave filter device
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US Patent 12006205 Micro-device structures with etch holes
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US Patent 11990438 Chiplets with connection posts
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US Patent 11981559 Enclosed cavity structures
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US Patent 11978825 LED with internally confined current injection area
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US Patent 11952266 Micro-device structures with etch holes
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US Patent 11950375 Printing components to substrate posts
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US Patent 11916179 Structures and methods for electrically connecting printed horizontal components
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US Patent 11890890 Rigid micro-modules with iLED and light conductor
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US Patent 11884537 Enclosed cavity structures
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Edits on 30 Jan, 2024
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US Patent 11881475 Modules with integrated circuits and devices
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Edits on 3 Jan, 2024
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edited on 3 Jan, 2024
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US Patent 11863154 Non-linear tethers for suspended devices
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