US Patent 8740040 Solder injection head
Patent 8740040 was granted and assigned to Samsung on June, 2014 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 30, 2012
Date of Patent
June 3, 2014
Patent Applicant
Patent Application Number
13664035
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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