US Patent 8740040 Solder injection head
Patent 8740040 was granted and assigned to Samsung on June, 2014 by the United States Patent and Trademark Office.
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Patent abstract
Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
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US Patent 08740040 Solder injection head US Patent 8740040 Solder injection head
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Patent Number
0874004000
Patent Number
874004000
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
087400400
Date of Patent
June 3, 2014
0Patent Application Number
136640350
Date Filed
October 30, 2012
0Official Website
Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
087400400
Date of Patent
June 3, 2014
0Patent Application Number
136640350
Date Filed
October 30, 2012
0Official Website
Patent Primary Examiner
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US Patent 08740040 Solder injection head
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
08740040
Date of patent
June 3, 2014
Patent application number
13664035
Date Filed
October 30, 2012
Patent primary examiner
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