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US Patent 8698577 Three-dimensional microstructures

Patent 8698577 was granted and assigned to Nuvotronics on April, 2014 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
‌
Nuvotronics
Date Filed
July 5, 2011
Date of Patent
April 15, 2014
Patent Application Number
13176740
Patent Citations Received
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US Patent 11949392 Broadband power combiner/splitter architecture with low losses
0
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US Patent 11955687 Structural arrangements for spatial power-combining devices
0
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US Patent 11665867 Thermal structures for heat transfer devices and spatial power-combining devices
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8698577
Patent Primary Examiner
Robert Pascal
Robert Pascal

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