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US Patent 8698577 Three-dimensional microstructures

Patent 8698577 was granted and assigned to Nuvotronics on April, 2014 by the United States Patent and Trademark Office.

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Current Assignee
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Nuvotronics
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8698577
Date of Patent
April 15, 2014
Patent Application Number
13176740
Date Filed
July 5, 2011
Patent Citations Received
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US Patent 11949392 Broadband power combiner/splitter architecture with low losses
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US Patent 11955687 Structural arrangements for spatial power-combining devices
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US Patent 11665867 Thermal structures for heat transfer devices and spatial power-combining devices
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Patent Primary Examiner
Robert Pascal
Robert Pascal
Patent abstract

An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

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