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US Patent 8697228 Carrier for glass substrates

Patent 8697228 was granted and assigned to Corning Incorporated on April, 2014 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Current Assignee
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8697228
Patent Inventor Names
Jean Waku-Nsimba0
Katrin Wondraczek0
Alain R. E. Carre0
Eric J. P. Francois0
Date of Patent
April 15, 2014
Patent Application Number
12772416
Date Filed
May 3, 2010
Patent Citations Received
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US Patent 12122138 Siloxane plasma polymers for sheet bonding
0
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US Patent 11713271 Device and method for cutting out contours from planar substrates by means of laser
0
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US Patent 11773004 Laser cutting and processing of display glass compositions
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US Patent 11774233 Method and system for measuring geometric parameters of through holes
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US Patent 11905201 Methods and articles including a sheet and a carrier
0
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US Patent 11972993 Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
0
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US Patent 11999135 Temporary bonding using polycationic polymers
0
Patent Primary Examiner
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David Sample
Patent abstract

A carrier (31) for a thin glass sheet (7) is disclosed. The carrier includes an elastomer (9) which has first (15) and second (17) opposed surfaces and a support (11) bonded to the first surface (15) of the elastomer (9). During use, the thin glass sheet (7) directly contacts and is releasably bonded to the elastomer's second surface (17). In order to provide a strong, yet releasable bond to the thin glass sheet (7), the elastomer's second surface (17) has a Shore A hardness in the range of 10-90 and a roughness less than or equal to 185 nanometers. In this way, the carrier/glass sheet assembly (13) is able to withstand the conditions encountered during manufacture of electronic components on the exposed surface (23) of the thin glass sheet (7).

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