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US Patent 12122138 Siloxane plasma polymers for sheet bonding

Patent 12122138 was granted and assigned to Corning on October, 2024 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
Corning
Corning
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Current Assignee
Corning
Corning
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
121221380
Patent Inventor Names
Jiangwei Feng0
Prantik Mazumder0
Robert Alan Bellman0
Date of Patent
October 22, 2024
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Patent Application Number
173923840
Date Filed
August 3, 2021
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Patent Citations
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US Patent 7056751 Method and system for increasing yield of vertically integrated devices
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US Patent 7060323 Method of forming interlayer insulating film
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US Patent 7118990 Methods for making large dimension, flexible piezoelectric ceramic tapes
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US Patent 7129311 Additives to prevent degradation of alkyl-hydrogen siloxanes
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US Patent 7144638 Organic light-emitting diode and material applied thereto
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US Patent 7147740 Method of transferring a laminate and method of manufacturing a semiconductor device
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US Patent 7166520 Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process
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US Patent 7220656 Strained semiconductor by wafer bonding with misorientation
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...
Patent Primary Examiner
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Sonya M Sengupta
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CPC Code
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B32B 7/12
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B32B 9/005
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B32B 9/04
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B32B 9/041
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C08G 77/04
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C08G 77/26
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C09D 183/00
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C09D 183/04
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Patent abstract

Described herein are glass articles and methods of making glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier or bonded together using a coating layer, which is preferably an organosiloxane polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the thin sheet, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The coating layer bonds the thin sheet and carrier together to prevent a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.

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