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US Patent 8680489 Lithography method and device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
September 28, 2012
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Date of Patent
March 25, 2014
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Patent Application Number
13629869
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Patent Citations Received
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US Patent 11972993 Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
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US Patent 11697178 Methods and apparatuses for laser processing materials
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US Patent 11713271 Device and method for cutting out contours from planar substrates by means of laser
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US Patent 11773004 Laser cutting and processing of display glass compositions
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US Patent 11774233 Method and system for measuring geometric parameters of through holes
Patent Inventor Names
Christophe Martinez
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Fabien Laulagnet
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Pascal Boulitreau
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8680489
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Patent Primary Examiner
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Kiet T Nguyen
0

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