US Patent 8653658 Planarized bumps for underfill control
Patent 8653658 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2014 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 30, 2011
Date of Patent
February 18, 2014
Patent Application Number
13308162
Patent Citations Received
Patent Inventor Names
Jing-Cheng Lin
0
Po-Hao Tsai
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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