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US Patent 8585873 Methods and apparatus for sputtering

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
October 12, 2005
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Date of Patent
November 19, 2013
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Patent Application Number
11247199
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Patent Citations Received
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US Patent 11749555 Semiconductor processing system
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US Patent 11756803 Gas delivery system for high pressure processing chamber
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US Patent 11881411 High pressure annealing process for metal containing materials
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US Patent 11694912 High pressure and high temperature anneal chamber
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US Patent 11705337 Tungsten defluorination by high pressure treatment
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8585873
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Patent Primary Examiner
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Michael Band
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