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US Patent 8465903 Radiation patternable CVD film

Patent 8465903 was granted and assigned to Applied Materials on June, 2013 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Applied Materials
Applied Materials
Date Filed
October 6, 2011
Date of Patent
June 18, 2013
Patent Application Number
13267341
Patent Citations Received
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US Patent 12062538 Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
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US Patent 12125711 Reducing roughness of extreme ultraviolet lithography resists
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US Patent 12105422 Photoresist development with halide chemistries
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US Patent 11705327 Low-k feature formation processes and structures formed thereby
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US Patent 11988965 Underlayer for photoresist adhesion and dose reduction
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US Patent 12068170 Vapor phase thermal etch solutions for metal oxo photoresists
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US Patent 11921427 Methods for making hard masks useful in next-generation lithography
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Patent Inventor Names
Amit Chatterjee
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Abhijit Basu Mallick
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Nitin K. Ingle
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Paul Deaton
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Timothy Michaelson
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Timothy W. Weidman
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8465903
Patent Primary Examiner
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Christopher Young

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