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US Patent 8444906 Method of cutting substrate

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 25, 2010
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Date of Patent
May 21, 2013
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Patent Application Number
12731479
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Patent Citations Received
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US Patent 11972993 Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
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US Patent 11713271 Device and method for cutting out contours from planar substrates by means of laser
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US Patent 11773004 Laser cutting and processing of display glass compositions
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US Patent 11774233 Method and system for measuring geometric parameters of through holes
Patent Inventor Names
Cheol-Lae Roh
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Hyun-Chul Lee
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Jae-Seok Park
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Jin-Han Park
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Joon-Hyung Kim
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Won-Kyu Lim
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Yong-Jin Lee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8444906
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Patent Primary Examiner
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Samuel M. Heinrich
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