Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cheol-Lae Roh0
Hyun-Chul Lee0
Jae-Seok Park0
Jin-Han Park0
Joon-Hyung Kim0
Won-Kyu Lim0
Yong-Jin Lee0
Date of Patent
May 21, 2013
0Patent Application Number
127314790
Date Filed
March 25, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
