Patent 8362579 was granted and assigned to Infineon Technologies on January, 2013 by the United States Patent and Trademark Office.
A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.