Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 29, 2013
Patent Application Number
12469512
Date Filed
May 20, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.
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