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US Patent 8228684 Multi chip electronic system

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Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
82286840
Patent Inventor Names
Aldo Losavio0
Giovanni Campardo0
Stefano Ricciardi0
Date of Patent
July 24, 2012
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Patent Application Number
121168520
Date Filed
May 7, 2008
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Patent Citations Received
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US Patent 12136562 3D semiconductor device and structure with single-crystal layers
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US Patent 12093628 Automation methods for 3D integrated circuits and devices
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US Patent 12094829 3D semiconductor device and structure
0
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US Patent 12094892 3D micro display device and structure
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US Patent 12094965 3D semiconductor device and structure with metal layers and memory cells
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US Patent 12120880 3D semiconductor device and structure with logic and memory
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US Patent 12125737 3D semiconductor device and structure with metal layers and memory cells
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US Patent 11694922 Multilevel semiconductor device and structure with oxide bonding
0
...
Patent Primary Examiner
‌
Yuriy Semenenko
0
Patent abstract

An electronic system adapted to perform a corresponding function and including at least a first subsystem and a second subsystem, the first subsystem and the second subsystem being operatively couplable to each other through a plurality of electric connections to perform the function of the system, in which the first subsystem and the second subsystem are respectively integrated on a first material chip and on a second material chip, the plurality of electric connections including a plurality of conductive through holes formed in at least one of the first and second chips and adapted to form a corresponding plurality of inter-chip electric connections when the first and the second chips are superimposed.

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