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US Patent 8211270 Method of detaching attached boards from each other

Patent 8211270 was granted and assigned to Nitto Denko on July, 2012 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Nitto Denko
Nitto Denko
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8211270
Patent Inventor Names
Ryuuichi Kabutoya0
Tatsuya Suzuki0
Yuuki Fukuda0
Date of Patent
July 3, 2012
Patent Application Number
12292614
Date Filed
November 21, 2008
Patent Citations Received
‌
US Patent 12122138 Siloxane plasma polymers for sheet bonding
0
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US Patent 11905201 Methods and articles including a sheet and a carrier
0
‌
US Patent 11999135 Temporary bonding using polycationic polymers
0
Patent Primary Examiner
‌
Mark A Osele
Patent abstract

A method of detaching two plates adhered via an adhesive sheet or a curable resin layer, comprising moving, relatively parallel to each other, said two plates to develop a shear stress causing rupture of said adhesive sheet or curable resin layer. According to the present invention, two plates bonded via an adhesive sheet or a curable resin layer can be detached by only moving the two plates relatively parallel to each other. Therefore, even when at least one of the two plates is thin and poor in flexibility, two plates can be detached from each other substantially without a force (load) which causes high distortion (deformation) producing a breakage or crack on the plates. Accordingly, for example, when two optical plates adhered via a transparent adhesive sheet need to be re-bonded, two optical plates can be detached from each other and adhered again. Thus, the production cost of equipment with a display function, which carries a flat-panel display, can be reduced.

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