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US Patent 8134070 Busbar pack

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
October 19, 2007
Date of Patent
March 13, 2012
Patent Application Number
12518567
Patent Citations Received
‌
US Patent 11876364 Multilayer electronic components with soldered through holes
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8134070
Patent Primary Examiner
‌
Angel R. Estrada

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