US Patent 11876364 Multilayer electronic components with soldered through holes

An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first through hole arranged around the electrical connection pin and a second through hole located radially outward of the first through hole.