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US Patent 11876364 Multilayer electronic components with soldered through holes

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 7, 2022
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Date of Patent
January 16, 2024
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Patent Application Number
17688469
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Patent Citations
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US Patent 7557298 Laminated bus bar assembly
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US Patent 8134070 Busbar pack
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US Patent 9270091 Multiple wrapped laminated bus bar system and method
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US Patent 9520235 Clad metal bus bar for film capacitor and film capacitor comprising the same
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US Patent 10128045 Film capacitor
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US Patent 10658941 Compact design of multilevel power converter systems
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US Patent 10475585 Film capacitor
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US Patent 10907268 Method for producing multi-layer bus bar unit
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US Patent 7092238 Metallized film capacitor
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US Patent 7529076 Film capacitor and method of manufacturing same
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Patent Inventor Names
Shuai Wang
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Chandana J. Gajanayake
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David R. Trawick
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11876364
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Patent Primary Examiner
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Hoa C Nguyen
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CPC Code
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H05K 1/0298
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H05K 1/116
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H02G 5/005
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H05K 1/181
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H05K 1/115
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