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US Patent 8105935 Method of manufacturing a semiconductor device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 19, 2008
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Date of Patent
January 31, 2012
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Patent Application Number
12051193
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Patent Citations Received
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US Patent 12122138 Siloxane plasma polymers for sheet bonding
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US Patent 11660841 Articles and methods for bonding sheets with carriers
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US Patent 11776813 Method for preparing semiconductor device structure with fine patterns at different levels
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US Patent 11905201 Methods and articles including a sheet and a carrier
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US Patent 11999135 Temporary bonding using polycationic polymers
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Patent Inventor Names
Hirofumi Watatani
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Naoki Ohara
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Tamotsu Owada
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Kenichi Yanai
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8105935
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Patent Primary Examiner
Jack Chiang
Jack Chiang
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