US Patent 7956449 Stacked integrated circuit package system

A stacked integrated circuit package system includes: forming a recessed integrated circuit package system having a first encapsulation over a first integrated circuit and an interior cavity in the first encapsulation; forming a mountable integrated circuit package system having a second integrated circuit over a carrier; and mounting the recessed integrated circuit package system over the mountable integrated circuit package system with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.