Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
KyungHoon Lee0
Oh Han Kim0
Date of Patent
June 7, 2011
0Patent Application Number
121461350
Date Filed
June 25, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A stacked integrated circuit package system includes: forming a recessed integrated circuit package system having a first encapsulation over a first integrated circuit and an interior cavity in the first encapsulation; forming a mountable integrated circuit package system having a second integrated circuit over a carrier; and mounting the recessed integrated circuit package system over the mountable integrated circuit package system with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.
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