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US Patent 7946050 Three-dimensional microprobe array

Patent 7946050 was granted and assigned to National Chiao Tung University on May, 2011 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12023162 Three-dimensional silicon-based comb probe with optimized biocompatible dimensions for neural sensing and stimulation
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Patent abstract

The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.

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Patent Inventor Names
Chih-Wei Chang0
Jin-Chern Chiou0
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US Patent 07946050 Three-dimensional microprobe array US Patent 7946050 Three-dimensional microprobe array

Infobox
Patent Number
079460500
Patent Number
79460500
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Infobox
Is a
Patent
Patent
0
Current Assignee
National Chiao Tung University
National Chiao Tung University
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
079460500
Date of Patent
May 24, 2011
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Patent Application Number
121288040
Date Filed
May 29, 2008
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Patent Primary Examiner
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Thomas P. Noland
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 US Patent 07946050 Three-dimensional microprobe array

Infobox
Is a
Patent
Patent
Current assignee
National Chiao Tung University
National Chiao Tung University
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07946050
Date of patent
May 24, 2011
Patent application number
12128804
Date Filed
May 29, 2008
Patent primary examiner
‌
Thomas P. Noland

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