Golden has been acquired by ComplyAdvantage.Read about it here ⟶

‌

US Patent 7946050 Three-dimensional microprobe array

Patent 7946050 was granted and assigned to National Chiao Tung University on May, 2011 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

0

Patent attributes

Current Assignee

National Chiao Tung University

0

Patent Jurisdiction

United States Patent and Trademark Office

0

Patent Number

Patent Inventor Names

Chih-Wei Chang0

Jin-Chern Chiou0

Date of Patent

May 24, 2011

0

Patent Application Number

121288040

Date Filed

May 29, 2008

0

Patent Citations Received

US Patent 12023162 Three-dimensional silicon-based comb probe with optimized biocompatible dimensions for neural sensing and stimulation

0

US Patent 11959874 Nanostructure featuring nano-topography with optimized electrical and biochemical properties

0

Patent Primary Examiner

Thomas P. Noland

0

Patent abstract

The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 7946050 Three-dimensional microprobe array

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Golden Query Tool

By using this site, you agree to our Terms of Service.