Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hirokazu Inoue0
Shinji Hiramitsu0
Koji Sasaki0
Akihiro Tamba0
Kazuhiro Suzuki0
Date of Patent
April 19, 2011
Patent Application Number
12105553
Date Filed
April 18, 2008
Patent Primary Examiner
Patent abstract
A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4±0.05 mmφ, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K.
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