US Patent 7863737 Integrated circuit package system with wire bond pattern
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Patent abstract
An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.
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Patent Inventor Names
Byoung Wook Jang0
Hun Teak Lee0
Kwang Soon Hwang0
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US Patent 07863737 Integrated circuit package system with wire bond pattern US Patent 7863737 Integrated circuit package system with wire bond pattern
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Patent Number
078637370
Patent Number
78637370
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Official Website
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Patent Jurisdiction
Patent Number
078637370
Date of Patent
January 4, 2011
0Patent Application Number
112784140
Date Filed
April 1, 2006
0Official Website
Patent Primary Examiner
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US Patent 07863737 Integrated circuit package system with wire bond pattern
Infobox
Is a
Patent jurisdiction
Patent number
07863737
Date of patent
January 4, 2011
Patent application number
11278414
Date Filed
April 1, 2006
Patent primary examiner
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