Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kwang Soon Hwang0
Byoung Wook Jang0
Hun Teak Lee0
Date of Patent
January 4, 2011
0Patent Application Number
112784140
Date Filed
April 1, 2006
0Patent Primary Examiner
Patent abstract
An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.
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