US Patent 7830022 Semiconductor package
Patent 7830022 was granted and assigned to Infineon Technologies on November, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 22, 2007
0
Date of Patent
November 9, 2010
0
Patent Application Number
11876241
0
Patent Inventor Names
Horst Theuss
0
Adolf Koller
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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