Patent 7830022 was granted and assigned to Infineon Technologies on November, 2010 by the United States Patent and Trademark Office.
A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip.